VLSI Verification Engineer:

  • VLSI design
  • Embedded Design Services
  • PCB Design and Manufacturing Services
  • RO Controller
  • Water Level Indicator with lamp indicaton
Promien Services is a Design and Product Company focused on VLSI Design, FPGA Based Design & Embedded Systems and nurturing the ecosystem for the same. Promien Services Semiconductor expertise spans FPGA based Design , VHDL / Verilog RTL Development & Verification, CMOS Layout & PCB Design. Our Embedded Software expertise ranges from Outsourced Product Development(OPD), Firmware & Device Drivers Development, RTOS Porting to Embedded Reference Board Development on microcontroller, ARM processor and DSP and many more… Promien Services Telecom Network Services Division (TNSD) provide managed network services that span planning and design, deployment, integration and testing, services migration. Our VLSI design team has rich experience in Design, Verification and Validation of complex digital designs. We offer Design services for ASIC/FPGA in Verilog/VHDL also we provide Verification and testing services using Verilog/VHDL Language for following circuits.

Embedded Design Services

Promien Services specializes in embedded system design and development. We develop firmware and hardware for microprocessors, system-on-chip (SoC), and microcontrollers. We support various target platforms and architectures: ARM, DSP, Cortex-M3, 8051. We typically use the 32bit RISK ARM7 and ARM Cortex-M3 processors in new designs because of their low cost and high performance. Mainly we refer controller from NXP, Renesas, Microchip, free scale. We have master embedded design experience in defense, automotive, industrial and other vertical markets. Our engineering team and state-of-the-art production facilities enable cost-effective customized solutions for projects both large and small.

PCB Design and Manufacturing Services

  • PCB Designing
  • Double Sided PCB Designing
  • RF PCB Designing
We are a prominent manufacturer, supplier and exporter of specialized high precision, high density, high reliability printed circuit boards (PCBs). We have established our company in 2013 with a firm commitment to match the international standards in the designing and manufacturing of PCBs..We have developed the finest systems to design and manufacture the top class PCBs. The quality is just at par to match the international standards. Equipped with the ultramodern machine, using a first grade material, we are in a position to manufacturer the PCBs as per the customers requirements, to their entire satisfactory.

RO Controller

RO Controller (Reverse Osmosis Controller) microcontroller based panels are ideally suited for small and medium sized RO plants as they have the complete operating logic pre-programmed. The panels basically can take 6 inputs from the three devices namely low pressure switch (LPS), High pressure switch (HPS), RAW tank level switch (LS) conductivity and control the 4 outputs Raw water pump (RWP), High Pressure Pump (HPP), the flushing solenoid valve, ALARM. The advanced electronics also takes care of required motor protection such as over load, dry running and single phasing. It is designed to control and monitor the operating parameters of a reverse osmosis water purification system.

Water Level Indicator with lamp indicaton

Four Water Level Indication +Alarm When Tank is filling , Water Level increases and LAMPs keep glowing one-by-one as 25%, 50%, 75% & 100%, When water level reaches 100% OR 25% alarm turns on . Acknowledge switch is provided to turn off the alarm. Promien Services VLSI Chip Design Group: Offers complete Chip Design expertise from RTL to GDSII implementations in 28nm, 32nm, 45nm technology nodes including pre and post-silicon testing & FPGA/Emulation based prototyping. Expertise includes Front End Design and Verification; as well as Backend Design and Physical Implementation. Promien Services Embedded & Platform Design Group: Offers wide expertise in developing Board Support Package, firmware, Device Drivers, Middleware components, Application on various hardware platform and RTOS flavors. Promien Services Outsourced Product Development Group: Offers Best ROI in terms of Concept to Product Development by providing end to end Software, Firmware, Hardware Design, Development & Productization of Idea. Expertise in developing multi-layer boards by taking into consideration Device Characterization, DFT and DFM requirements, design evolution/succession requirements and the need to realize optimized BOM. Promien Services Skill/Competency Development Group: Provides quality, industry & placement oriented skill building/enhancement solutions to educational institutes and students so as to enhance the ecosystem and make students Industry Ready.

3D-IC Design Solutions

  • Allows heterogeneous integration of different dies
  • Improves performance
  • Reduces power consumption
  • Provides maximum functionality in a smaller form factor to support numerous applications in networking, graphics, mobile communications and networking
Ever wonder when the law of physics will come into play with semiconductor designs? Thankfully, plenty of scientists and engineers are working hard to extend the laws as we have known them for IC and SoC design. 3D-IC technology is an alternative path (often called “more than Moore’s”) to further extend Moore’s Law in order to generate higher bandwidth, lower power consumption, and reduced area without traditional process scaling. The technology applies to various applications, from networking and high-performance computing to wearables and the Internet of Things (IoT). As with any new solution, 3D-IC comes with unique new challenges, including: Thermal management: The through-silicon-vias (TSVs) in 3D-ICs can result in poor lateral heat distribution, more heat dissipation, and reduced performance if not managed properly Test strategies: Test access is only at the bottom die, so you’ll need a design-for-test methodology that propagates test stimuli and responses up and down through the stack to better identify problem points Other design enablement: Electronic design automation (EDA) requires some enhancement for 3D-ICs, from package silicon co-design to new layout layers, new extraction features, mechanical constraints, and many other considerations Addressing these new challenges calls for adaptations in your design flow and signoff/analysis flow.

Design Flow for 3D-ICs

If your design team is like most, there could be digital engineers and analog/mixed-signal engineers responsible for 3D-IC design. Promien Services digital design and signoff flow is part of our comprehensive infrastructure for 3D-IC design. Promien Services provides a single source of IP, implementation, test, analysis, and verification products that address the challenges of 3D-IC design for digital SoCs, analog/mixed-signal designs, and entire systems. Many of these tools are integrated and feature a common UI to help enhance your design productivity. To efficiently plan and assess connectivity and route feasibility in your 3D-IC design, look to Promien Services OrbitIO™ Interconnect Designer. You’ll be able to quickly evaluate the connectivity between the die and package in the context of your full system. You’ll also be equipped to make or refine decisions and, right away, visualize the impact on adjacent fabrics within this single tool. This capability will help you cut down on iterations between silicon and package design teams. When you’re ready to test, look to our Genus™ Synthesis Solution and Modus™ Test products for logic die design for test (DFT). Using these tools, you can perform a DFT insertion to test the die-to-die interconnect, including silicon interposers. For logic die implementation, look to our Innovus™ Implementation System and our Physical Verification System. With unique capabilities in place and route, optimization, and clocking, the Innovus Implementation System delivers production-proven power, performance, and area (PPA) advantages as well as faster turnaround times. An Innovus plug-in provides functions for 3D-IC designs, including creation of TSVs and micro-bumps. Physical Verification System (PVS) can perform design rule checking (DRC) as well as layout vs. schematic (LVS) that runs multiple die verification concurrently. If your design also contains analog components, you can use this same flow. Integrated into this flow, our Virtuoso® custom design platform can support custom 3D-IC realization, from TSV feed-through implementation on the memory die to the mapping of memory die bumps to the logic die. Promien Services OpenAccess database provides a natively unified database for inter-operation between the Innovus and Virtuoso platforms. For example, in a typical interposer design that contains many bus signals that require not only minimal delay but also delay matching, using the slack-driven routing technology in the Innovus Implementation System as well as Virtuoso Space-Based Router may yield better implementation results. Promien Services SiP Layout can also help with silicon interposer design. It can even display both silicon layers and package layers in a single design window for easier viewing and editing, providing a great platform for packaging engineers to do multi-die integration.

Signoff and Analysis Flow for 3D-ICs

In the analysis and signoff phase, you’ll need to validate your design, ensuring that the inter-die in your 3D implementation is correct. You can use our Physical Verification System to perform a cross die check. You’ll also need to evaluate electrical performance. On the digital side, we offer an array of tools for extraction and timing and power signoff: Quantus™ Extraction Solution provides parasitic extraction and analysis for TSVs, micro-bumps, and other characteristics associated with 3D technologies Tempus™ Timing Signoff Solution provides silicon-accurate timing signoff and signal integrity analysis across multiple dies Voltus™ IC Power Integrity Solution provides not only a single full-chip, but also the entire multi-die, 3D-IC system in a package

Thermal Management

Promien Services offers a unique capability for thermal management of 3D-IC designs. Our Voltus IC Power Integrity Solution generates a power map that is then fed into Promien Services Sigrity™ PowerDC technology, the thermal analyzer that takes power consumption data and determines the temperature distribution for each die. This data then goes back to the Voltus solution for temperature-dependent IR-drop analysis. If you need to run thermal analysis through many iterations, the Voltus solution provides a GUI that allows you to invoke the thermal engine within the solution to get the temperature results automatically displayed at the die level. For More Information To learn more about Promien Services 3D-IC solution, please complete and submit this brief form to hear back from one of our technical experts.

FPGA Development

  • From system design, to verification, to board implementation flow
  • Scalable verification methodology
  • Native integration into FPGA vendor flows
  • Complete set of tools and methodologies for DO-254 compliance
  • Methodology and tool support for DO-254 verification requirements traceability
Due to the ever-increasing costs of development and manufacturing of custom IC devices as well as the flexibility that FPGAs provide, many system houses use FPGA devices not just for prototype or early availability runs, but for the entire life of the product. The result is the number of designs that are implemented in FPGAs is growing, and the complexity of those designs is increasing, requiring more powerful EDA tools for design, up-front verification, debug, and implementation. Promien Services offers a variety of tools and methodologies that enable users to develop their FPGA designs quickly and effectively to improve quality and time to FPGA signoff. Our tools and our FPGA vendor relationships help users avoid long programming and field testing cycles.